SE Modicon M580 Brochure

Modicon M580 automation platform Architectures Distributed I/O architecture

Presentation (continued)

Presentation The distributed I/O architecture consists of I/O and devices distributed over Ethernet (DIO). The Ethernet DIO devices can be connected to Ethernet ports of the BMEP58 p 0 p 0 CPU 1 or a Modicon DRS (dual ring switch). The available Ethernet DIO devices are: b Modicon STB distributed I/O 2 b Altivar Process variable speed drive 3 b Energy supervision 4 and HMI b Tesys U 5 connected via CANopen to a Modicon STB I/O Island and Tesys T/ Tesys Island 6 motor protection, etc. Modbus serial link devices can be integrated in the distributed I/O architecture via the BMXNOM0200 serial link module. The BMENOS0300 Ethernet switch module 8 can be installed on a local or remote BMEXBP pppp Ethernet main rack in the Modicon M580 platform. The external Modicon switch 7 (1) can be loaded with 15 predefined configurations to simplify their implementation. The use of these switches provides enhanced capacity for integrating the following devices: b DIO sub-rings b DIO clouds The advantages of this architecture are: b High availability of the Ethernet DIO devices Maximum distance between each Modicon managed switch: b 100 m/ 328 ft with copper medium b 2 km/ 1.25 mi with multimode optical fiber medium b 16 km/ 9.94 mi with single-mode optical fiber medium (1) Supported Modicon switches: MCSESM083F23F1 , MCSESM103F2CU1 , and MCSESM103F2CS1 . High availability and expanded integration capacity The distributed I/O architecture can use the embedded switching module or the external switches to expand the integration capacity.

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Distributed I/O architecture: devices distributed over Ethernet with BMENOS0300

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Distributed I/O architecture: devices distributed over Ethernet with Modicon switch

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Processors: page 2/2

Modicon M580 modules for severe environments: page 6/2

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